multilayer pcb with BGA

multilayer pcb with BGA 1.UL,SGS,ROHS,IS09001,CE,IPC 2..High quality&competitive price 3..Quickly delivery&OEM.

multilayer pcb with BGA

 1.Base Material:fr4

2.copper thickness:2oz

3.board thickness:1.6mm

4.Surface treatment:ENIG

5.layer:4-layer

The advantages:

1.Transportation by air.by ship,by express,up to you

2.A line with automatic production,decrease more cost for mass production.3.. No middlemen/No trading companies,OEM4.. Good prices,high quality for automatic,lowest cost,quickly time.

5.Delivery time: Sample is 2-3 days and mass production is 5-12days.6.Top of China within this line.

7..Inner vacuum and plastic package,outer carton box package.

8.Good wills for our clients and good credit for B2B.

9..payment:by T/T or L/C

10.High quality and competitive price

Please don't hesitate to send us your Gerber files now.

With a wide range, good quality, reasonable prices and stylish designs, our products are extensively used in aerospace,

medical equipment, telecommunication and other industries. For many years, our products have been well received by

the markets and trusted by our customers.With 6 years' experience and dedicated staff, we are now able to reach a monthly production capacity of 12000 square

meters of boards complying with UL, RoHS and other international certificate standards

productive power:

	Specification Inch (mm)
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium
Layer No.	1-30
Board thickness	0.015" (0.4mm)-0.125" (3.2mm)
Board Thickness Tolerance	± 10%
Cooper thickness	1/2OZ-3OZ
Impedance Control	± 10%
Warpage	0.075%-1.5%
Peelable	0.012" (0.3mm)-0.02’ (0.5mm)
Min Trace Width (a)	0.005" (0.125mm)
Min Space Width (b)	0.005" (0.125mm)
Min Annular Ring	0.005" (0.125mm)
SMD Pitch (a)	0.012" (0.3mm)
BGA Pitch (b)	0.027" (0.675mm)
Regesiter torlerance	0.05mm
Min Solder Mask Dam (a)	0.005" (0.125mm)
Soldermask Clearance (b)	0.005" (0.125mm)
Min SMT Pad spacing (c)	0.004" (0.1mm)
Solder Mask Thickness	0.0007" (0.018mm)
Hole size	0.01" (0.25mm)-- 0.257" (6.5mm)
Hole Size Tol (+/-)	± 0.003" (± 0.0762mm)
Aspect Ratio	6: 1
Hole Registration	0.004" (0.1mm)
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel  3-7um  Au: 1-3u' '
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	± 0.004' ' (± 0.1mm)
Beveling	30° 45°
V-cut	15° 30° 45° 60°
Certificate	ROHS  ISO9001: 2000  TS16949  SGS   UL

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multilayer pcb with BGA